Skal 27 - Epitaxy Techniques and Classifications
Video lecture series from IIT Professors (Not Available in NPTEL)
VLSI Technology by Prof.Santiram Kal, IIT KGP
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1. Introduction to VLSI
2. Design and Technology Overview of VLSI - I
3. Design and Technology Overview of VLSI - II
4. Yield and cost Estimation of VLSI Chips
5. Defects, Contamination & Clean Room Requirements
6. Wafer Cleaning Technology
7. Oxidation of Silicon
8. Reaction Kinetics of Oxide Growth in Silicon
9. Oxidation Techniques, Growth Rate & Characterization
10. Lithography Process
11. Photoresists
12. Optical Lithography Techniques
13. Exposure Tools and Optical Effects in Lithography
14. Advanced Lithography Techniques (X-ray,Ion-Beam,E-Beam)
15. Etching
16.
17. Dry & Plasma Etching
18.
19. Impurity Diffusion in Semiconductors
20. Diffusion Theory and Diffusion Systems
21. Impurities in Silicon and Diffusion Profile
22. Evaluation of Diffused Layers in Semiconductors
23. Ion Implantation : Range Theory and Stopping Mechanism
24. Ion Implantation Theory and Channeling
25. Ion Implant Machine
26. High Energy High Dose Implantation
27. Epitaxy Techniques and Classifications
28. Vapor Phase and Liquid Phase Epitaxy
29. VPE Growth Kinetics and MBE
30. Defects in Epitaxy Growth, Selective Epitaxy
31. Chemical Vapor Deposition (CVD): APCVD, LPCVD
32. CVD Techniques: PECVD, RTCVD, UHVCVD
33. Metal CVD and MOCVD
34. Materials for Contacts and Interconnects in VLSI
35. Metallization Techniques - I : Physical Evaporation
36. Metallization Techniques - II : Sputtering
37. Metallization Problems and Failure Mechanisms
38. Silicides and Copper Metallization
39. Isolation Technology in VLsI
40. Advanced Isolation Technology in VLSI
41. Bipolar VLSI Process Technology
42.
43. MOS VLSI Process Technology
44. Advanced VLSI MOS/CMOS Process
45. CMOS/BiCMOS Process Technology
46. VLSI Assembly & Packaging : Chip and Wire Bonding
47. VLSI Packaging Technology