Mod-03 Lec-14 Multichip modules (MCM)-types; System-in-package (SIP); Packaging roadmaps
0
0
15 Views·
03 Jul 2019
An Introduction to Electronics Systems Packaging by Prof. G.V. Mahesh, Department of Electronic system Engineering, IISc Bangalore.For more details on NPTEL visit http://nptel.iitm.ac.in
Show more
100% online learning from the world's best universities, organisations and Instructors
0 Comments
sort Sort By